Backside Power Delivery:

Start: Sunday, February 23, 2025 1:15PM
End: Tuesday, February 25, 2025 1:45PM

Backside Power Delivery: A Game-Changer for Future Chips

In addition to its SRAM density breakthrough, Intel is introducing another industry-first innovation: BSPDN (Backside Power Delivery Network). This revolutionary technology transfers power through the back of the silicon wafer, rather than the traditional front-side approach. The new method is expected to enhance power efficiency and performance, reducing resistance and improving overall chip design.

Intel is preparing to implement BSPDN in its upcoming Panther Lake processors, potentially making them among the first commercial chips to feature this next-generation power delivery system. If successful, this could set a new standard for semiconductor design, giving Intel a key advantage over competitors

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